首页> 外文OA文献 >Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring
【2h】

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

机译:CMOS电容式传感器芯片的低温共烧陶瓷封装,可用于电池寿命监控

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.
机译:细胞生存力监测是生物安全性评估的重要组成部分,用于检测纳米材料对细胞产生的毒性作用,最好采用无标记,无创,快速且经济高效的方法。通过使用电容感应集成电路(IC)微芯片监控电池的活力,可以满足这些要求。电容提供对粘附细胞表面附着的测量,以指示其健康状况。但是,潮湿,温暖和腐蚀性的生物环境需要可靠封装传感器芯片。在这项工作中,将第二代低温共烧陶瓷(LTCC)技术与倒装芯片结合在一起,以提供与细胞培养兼容的耐用包装。封装有LTCC的传感器芯片已与印刷电路板,数据采集设备和测量控制软件集成在一起。封装的传感器芯片在存在电池介质和电池的情况下运行良好,其输出电压取决于电容器上方的介质。此外,还演示了在LTCC封装中制造微流体通道。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号